Fundamentals of chemistry and semiconductor device fabrication.
Semiconductor Technology from A to Z
How a chip is made —
layer by layer.
The complete path through fabrication: from the fundamentals of chemistry through wafers, oxidation and photolithography to dry etching.
Feature size over time10 µm → 2 nm
From grain of sand to silicon wafers, doping techniques.
Fabrication, application and measuring of oxide layers.
Insight of chemical and physical deposition methods, plasma generation.
Contacting of integrated devices, aluminum and copper technology.
Overview of processes in the photolithograhpy and photomasks.
Wet-chemical etching, wafer cleaning and cleanroom technique.
Dry etching and dry etching processes.
Electrical testing of dies on the wafer, yield mapping and final test.
From wafer to finished component: dicing, die attach, bonding and encapsulation.