Fundamentals of chemistry and semiconductor device fabrication.
Semiconductor Technology from A to Z
How a chip is made —
layer by layer.
The complete path through fabrication: from the fundamentals of chemistry through wafers, oxidation and photolithography to dry etching.
Feature size over time10 µm → 2 nm
From grain of sand to silicon wafers, doping techniques.
Fabrication, application and measuring of oxide layers.
Insight of chemical and physical deposition methods, plasma generation.
Contacting of integrated devices, aluminum and copper technology.
Overview of processes in the photolithograhpy and photomasks.
Wet-chemical etching, wafer cleaning and cleanroom technique.
Dry etching and dry etching processes.
Material system, epitaxy and power devices based on SiC and GaN compared to silicon.
Thickness measurement and particle inspection
Electrical testing of dies on the wafer, yield mapping and final test.
From wafer to finished component: dicing, die attach, bonding and encapsulation.
Advanced packaging and 3D integration: from the through-silicon via to the chiplet system
Structure and fabrication of MOSFETs, bipolar transistors, FinFETs and DRAM.
- From transistor to logic gate
- The CMOS Fabrication Flow
- The SRAM Cell
- The DRAM Cell
- The Flash Memory Cell
- Design Rules
- Layout versus Schematic (LVS)
- Circuit Layouts
- Processor Architecture
- CPU vs. GPU
- Why New Memory Technologies?
- MRAM – Magnetoresistive RAM
- ReRAM – Resistive RAM
- PCM – Phase-Change Memory
- Comparison & Context
Structure, fabrication and application of micro-electro-mechanical systems (MEMS).
LEDs, laser diodes and photodiodes – structure, material systems and applications of optoelectronic devices